CHO-BOND® Adhesives
CHO-BOND® adhesives are electrically conductive epoxy and silicone resins that cure at room temperature, elevated temperature or in humidity. CHO-BOND epoxies are two-part, silver-filled or silver-plated-copper-filled adhesives which cure at room or elevated temperatures into rigid structural bonds for attaching EMI vents, windows, mesh gaskets, or for filling cracks and seams. CHO-BOND conductive silicones contain silver-plated-copper. Their flexible nature in cured form is ideal for bonding conductive silicone gaskets in place.
Download SYRINGE-PAK Data Sheet (.pdf)
Download Data Sheet (.pdf)
| Material | Description/ (.pdf) | Material | Description/ (.pdf) | |
| 360 | Conductive Epoxy | 1029 - Part A | Conductive Adhesive | |
| 584 | Conductive Epoxy | 1029 - Part B | Conductive Adhesive | |
| 592 - Part A | Conductive Epoxy | 1030 | Conductive Silicone | |
| SV712 | Conductive Epoxy | 1035 | Conductive Sealant | |
| SV713 | Conductive Epoxy | 1075 | Conductive Silicone |
MSDS Documents for CHO-BOND Adhesive Hardeners and Primers
| Material | Description/ (.pdf) | Material | Description/ (.pdf) | |
| 20 | Conductive Hardener 20 | 592 - Part B | Conductive Hardener | |
| 29 | Conductive Hardener 29 | 1085 | Silicone Primer | |
| 208 | Conductive Hardener 208 | 1086 | Silicone Primer |