THERM-A-FORM Form-In-Place Compounds
THERM-A-FORM™ form-in-place materials are used for heat transfer applications in electronic component cooling. These flexible elastomer compounds minimize stress on components. They are available in a range of kit sizes for both manual and pneumatic dispensing.
THERM-A-FORM T642 silicone encapsulant is ideal for underfilling or other component-level heat transfer applications.
THERM-A-FORM T644/T644G compound is a very low modulus material for transferring heat from fragile electronic parts.
THERM-A-FORM T646 compound transfers heat from hot components to heat sinks, PC boards, metal enclosures and chassis. It combines high thermal conductivity and low cost into an easily applied solution.