Process
 Type		  Temperature  
 Range °C/°F		  Process
 Environment		  Parker 
 Suggested
 Compounds		  Industry
 Cross -
 Reference
 Compounds		  Typical 
 Applications

        Plasma
          and
          Gas
     Deposition		  Etching  25°C-225°C
 77°F-437°F		  Fluorine, 
 Chlorine, O2, 		  Best
 FF350-75
 FF370-75		  8085
 8002
 E38
 639
 SZ488
 SZ486		  StaticSeals:
 Lids end
 Point
 Windows 
 Chambers Gas
 inlets/outlets
 KF Centering
 Rings
 Fanges, Fittings
 Electrode Seals
 Ashing  25°C-250°C
 77°F-480°F		  O2/O3/H2O
 HPPCVD/ 
 PECVD/
 CVD		  25°C-250°C
 77°F-480°F		  TEOS/O3,
 SiH4/O2,
 NF3/C2F6/CF4
 PVD  25°C-250°C
 77°F-480°F
 Air, High 
 Vacuum		  Alternative:
 FF352-75
 Metal CVD  25°C-250°C
 77°F-480°F
 TEOS/O3,
 SiH4/O2,
 NF3/C2F6/CF4,
 WF6/CIF3
 Copper  25°C-250°C
 77°F-480°F		  TEOS/O3, 
 SiH4/O2,
 NF3/C2F6/CF4,
 WF6/CIF3		  Best:
 FF350-75
 FF370-75		  8085
 8002
 E38
 639
 SZ488
 SZ486		  Dynamic
 Seals: 
 Slit Valve Doors
 Mass Flow
 Controls
 Throttle Valves
 Isolator Valves
 Exhaust Valves
 Fittings Door
 Seals
 ALD  25°C-250°C
 77°F-480°F		  O2/O3/H2O, 
 NF3/CF4/CIF3		  Alternative:
 FF352-75
   Oxidation/ 
 Diffusion		  150°C-300°C 
 302°F-572°F		  N2/O2/H2O  Best:
 FF200-75
 FF350-75
 FF356-75*		  7075UP
 8475
 653
 655		  Static Seals:
 Lids EndPoint
 Windows
 Chambers Gas
 inlets/outlets
 KF Centering
 Rings Flanges
 Quartz
 Chambers Bell
 Jars

      Thermal		  LPCVD  150°C-300°C
 302°F-572°F		  NH3
 RTP Lamp
 Anneal		  150°C-300°C
 302°F-572°F		  IR 
 Resistance /
 Low
 Outgassing /
 Thermal 
 Stability		  Alternative:
 FF352-75		  8475
 653
 655		  Dynamic Seals:
 Slit Valve Doors
 Mass Flow
 Controls 
 Throttle
 Valves Isolator
 Valves Exhaust
 Valves Fittings
 
         Wet		  Surface
 Prep,Cleaning,
 Rinse		  25°C-125°C
 77°F-257°F		  UPDI, SC-1,
 HF, HCL 		  Best:
 FF500-75		  6375UP
 4079
 570
 571
 550
 SZ487
 SZ495
 SZ489		  Static Seals:
 Lids Chemical
 Containers
 Chemical 
 Baths.

 Dynamic 
 Seals: 
 Pumps Valves
 Connectors
 Flow Meters
 Filters Contact 
 Rings Thrust
 Plates 


 Wet
 Etching		  25°C-180°C
 77°F-356°F		  UPDI, HF, 
 H2SO4
 Photolithography,
 Developing,
 Rinse		  25°C-250°C
 77°F-480°F		  nMP, H2SO4,
 NaOH
 Wet Strip  25°C-125°C
 77°F-257°F		  nMP, H2SO4,
 NaOH		  Alternative:
 FF200-75
 FF350-75		  6375UP
 1050LF
 Copper
 Plating		  25°C-100°C
 77°F-212°F		  UPDI, CuSO4,
 H2SO4		  6375UP
 Products in BOLD are preferred. * Ideal for use in composite (Rubber to metal) sealing 
 configurations such as Slit Valve and UHP Gate Valve Doors