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chemraz® greene tweed compounds

Compound Information
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Chemraz® Compound	Elastomer	Hardness (Shore A)	Application	Color	Temp (°C)
Chemraz® XCD	FFKM	74	High Thermal Resistance, Low Compression Set (LPCVD, RTP, Thermal CVD, ALD)	Black	300°C
Chemraz® XRZ	FFKM	67	Plasma Resistance in High Fluorine Environments. Deposition (CVD, PECVD, HDPCVD, PEALD), Plasma etch (fluorine species), Remote plasma cleans	Translucent Brown	300°C
Chemraz® 513	FFKM	80	Good Plasma Resistance and Good Physical Properties, CVD, PVD, sputtering, evaporation, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, Dry plasma etch	White	210°C
Chemraz® 520	FFKM	90	Withstands harsh chemistries and high sealing loads, Metallization, Deposition, Dry Plasma etch, Dry ashing	White	240°C
Chemraz® 543	FFKM	80	Good Plasma Resistance and Good Physical Properties, Metallization, Deposition, Dry Plasma etch, Dry ashing	White	210°C
Chemraz® 550	FFKM	75	Excellent Acid Resistance, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating	Black	210°C
Chemraz® 551	FFKM	80	Broad Chemical Compatibility, High Temperature, Wet etch , Wet photo resist strip, Wet Cleaning	Black	316°C
Chemraz® 570	FFKM	70	Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP	White	210°C
Chemraz® 571	FFKM	80	Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP	White	210°C
Chemraz® 592	FFKM	80	Excellent Resistance to Plasma, good physical properties, Dry ashing, Oxidation, Metallization, Deposition, Dry plasma etch	White	240°C
Chemraz® 629	FFKM	75	Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch	Translucent Ivory	260°C
Chemraz® 639	FFKM	80	Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch	Translucent Ivory	260°C
Chemraz® 640	FFKM	80	Minimal Particulation, High Purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch, RTP/diffusion	Brown	290°C
Chemraz® 644	FFKM	75	Minimal contamination in Dry Plasma Processes, High Temperature, Dry plasma etch, Dry ashing	Dark Green	315°C
Chemraz® 653	FFKM	80	High Temp, superior comp set, Excellent plasma resistance, Oxidation (LPCVD), Diffusion, RTP	Black	324°C
Chemraz® 655	FFKM	82	High Temp, Minimal contamination, withstands aggressive chemicals, RTP, Oxidation (LPCVD), Diffusion	Off-White	315°C
Chemraz® 656	FFKM	70	Bonded Slit Valve Gates, Very Low Metallic Ion Content, low sealing force, Deposition, Dry plasma etch, remote plasma cleans	Translucent	232°C
Chemraz® 661	FFKM	80	Minimal Particulation, Maximum Plasma Resistance, Deposition, Dry plasma etch, remote plasma cleans	White	260°C
Chemraz® 667	FFKM	65	Enhanced Performance in Dry O2 Based Plasma Etch, High Temp, low comp set	Burgundy	300°C
Chemraz® E38	FFKM	70	Minimal contamination, low metal ion content, withstands aggressive chemicals, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, plasma cleans	White	260°C