DESCRIPTION:
• CHO-FLEX 601 coating is specifically designed for EMI shielding of copper/Kapton flexible circuit laminates and for printing circuits on Kapton film. Upon cure, this coating exhibits excellent adhesion and flexibility, thermal stability, high conductivity and superior peel strength. It can be sprayed or silkscreened, and will withstand wave solder temperatures above 500°F (260°C) without losing any of its exceptional properties.
• CHO-FLEX 4430 polyester ink was developed for the membrane keyboard and sensor industries. It bonds to Mylar† films, and can be creased, heat-formed or scratched without affecting its performance. Pure silverfilled CHO-FLEX 4430 ink offers surface resistivity of 0.050 ohm/square at 0.0005 inch (0.013 mm) thickness.
