DESCRIPTION: EMI Shielding Covers with Over-Molded Conductive Elastomer Gasket CHO-VER SHIELD EMI shielding covers combine a slim-profile metal or metallized plastic substrate with a low-closure force conductive elastomer gasket over-molded directly onto the substrate. These custom configurations rovide economical, easily-installed EMI shielding in cellular handsets, PCs and other highvolume production packages where minimal closure force is available. The capability to over-mold a conductive elastomer onto small flanges for consistent, high-quality, high-volume production parts is the result of technology advances pioneered by Chomerics. This capability includes simultaneous molding of the EMI gasket onto opposite sides of the cover. The over-molded shielding gasket is CHO-SEAL® 1310, a silver-platedglass filled conductive elastomer, typical properties for which are provided in Table 1, on page 13. Ideal for High Volume Applications.
The CHO-VER SHIELD technology is already providing a highly cost-effective shielding solution in such large-scale production applications as mobile handsets and handheld wireless devices, as well as mobile site equipment, microwave equipment and antennas. CHO-VER SHIELD covers can be used to shield elected areas of printed circuit boards, eliminating the need to add conductive plating to exterior housing parts of electronic devices. Moreover, CHO-VER SHIELD covers provide an alternative to using soldermounted metal cans as an EMI shield over components, with the added benefit of easy removal for PCB access during assembly or after testing. Pins, holes and other locating features are routinely designed into CHO-VER SHIELD EMI covers for fast and precise installation.
