| Process Type |
Temperature Range °C/°F |
Process Environment |
Parker Suggested Compounds |
Industry Cross - Reference Compounds |
Typical Applications |
|
![]() Plasma and Gas Deposition |
Etching | 25°C-225°C 77°F-437°F |
Fluorine, Chlorine, O2, |
Best FF350-75 FF370-75 |
8085 8002 E38 639 SZ488 SZ486 |
StaticSeals: Lids end Point Windows Chambers Gas inlets/outlets KF Centering Rings Fanges, Fittings Electrode Seals |
| Ashing | 25°C-250°C 77°F-480°F |
O2/O3/H2O | ||||
| HPPCVD/ PECVD/ CVD |
25°C-250°C 77°F-480°F |
TEOS/O3, SiH4/O2, NF3/C2F6/CF4 |
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| PVD | 25°C-250°C 77°F-480°F |
Air, High Vacuum |
Alternative: FF352-75 |
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| Metal CVD | 25°C-250°C 77°F-480°F |
TEOS/O3, SiH4/O2, NF3/C2F6/CF4, WF6/CIF3 |
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| Copper | 25°C-250°C 77°F-480°F |
TEOS/O3, SiH4/O2, NF3/C2F6/CF4, WF6/CIF3 |
Best: FF350-75 FF370-75 |
8085 8002 E38 639 SZ488 SZ486 |
Dynamic Seals: Slit Valve Doors Mass Flow Controls Throttle Valves Isolator Valves Exhaust Valves Fittings Door Seals |
|
| ALD | 25°C-250°C 77°F-480°F |
O2/O3/H2O, NF3/CF4/CIF3 |
Alternative: FF352-75 |
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| Oxidation/ Diffusion |
150°C-300°C 302°F-572°F |
N2/O2/H2O | Best: FF200-75 FF350-75 FF356-75* |
7075UP 8475 653 655 |
Static Seals: Lids EndPoint Windows Chambers Gas inlets/outlets KF Centering Rings Flanges Quartz Chambers Bell Jars |
|
![]() Thermal |
LPCVD | 150°C-300°C 302°F-572°F |
NH3 | |||
| RTP Lamp Anneal |
150°C-300°C 302°F-572°F |
IR Resistance / Low Outgassing / Thermal Stability |
Alternative: FF352-75 |
8475 653 655 |
Dynamic Seals: Slit Valve Doors Mass Flow Controls Throttle Valves Isolator Valves Exhaust Valves Fittings |
|
![]() Wet |
Surface Prep,Cleaning, Rinse |
25°C-125°C 77°F-257°F |
UPDI, SC-1, HF, HCL |
Best: FF500-75 |
6375UP 4079 570 571 550 SZ487 SZ495 SZ489 |
Static Seals: Lids Chemical Containers Chemical Baths. Dynamic Seals: Pumps Valves Connectors Flow Meters Filters Contact Rings Thrust Plates |
Wet Etching |
25°C-180°C 77°F-356°F |
UPDI, HF, H2SO4 |
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| Photolithography, Developing, Rinse |
25°C-250°C 77°F-480°F |
nMP, H2SO4, NaOH |
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| Wet Strip | 25°C-125°C 77°F-257°F |
nMP, H2SO4, NaOH |
Alternative: FF200-75 FF350-75 |
6375UP 1050LF |
||
| Copper Plating |
25°C-100°C 77°F-212°F |
UPDI, CuSO4, H2SO4 |
6375UP | |||
| Products in BOLD are preferred. * Ideal for use in composite (Rubber to metal) sealing configurations such as Slit Valve and UHP Gate Valve Doors |
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