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semiconductor, micro-e

Parker
Kalrez
Simrez
Chemraz
Perlast

Parker Compound	Elastomer	Hardness Shore A	Applications	Color	Temp °F (°C)
Parofluor Ultra (FFKM)
FF354-65	FFKM	65	High Purity, low closure force for static sealing, excellent continuous high temp stability, compression set resistance & mechanical properties. Broad chemical resistance for wet and dry processes.	White	600°F (316°C)
FF102-75	FFKM	75	Acid Resistant	Black	525°F (260°C)
FF200-75	FFKM	75	High Temp, Low Compression Set, Chemical resistance, RTP, Oxidation, diffusion, LPCVD	Black	608°F (320°C)
FF350-75	FFKM	75	High Purity, High Temp, Low Compression Set, Plasma & Gas deposition, Etching, Ashing, PVD, CVD, ALD, HDPCVD, PECVD, RTP, Oxidation, diffusion, thermal, LPCVD	White	600°F (316°C)
FF352-75	FFKM	75	Clean, Improved O2 Plasma resistance, High Temp, Low Compression set, Plasma & Gas deposition, Etching, Ashing, PVD, CVD, ALD, HDPCVD, PECVD, RTP, Oxidation, diffusion, thermal, LPCVD	White	600°F (316°C)
FF356-75	FFKM	75	High Purity, High Temp, Low Compression Set, low outgassing, broad chemical resistance, RTP, Oxidation, diffusion, thermal, LPCVD	White	600°F (316°C)
FF370-75	FFKM	75	Non-filled High Purity, low extractable, Minimum particles, High Temp, low compression set (no fillers), Plasma & Gas deposition, Etching, Ashing, PVD, CVD, ALD, HDPCVD, PECVD	Opaque - Black	572°F (300°C)
FF500-75	FFKM	75	Broad Chemical Resistance, outstanding compression set resistance, wet processes, wet etching, copper palting, photolithography, surface prep, cleaning, rinse	Black	525°F (260°C)
FF202-90	FFKM	90	High Temp, Low Compression Set, Chemical resistance	Black	608°F (320°C)
Parofluor (FFKM)
V1266-65	FFKM	65	Plasma, Low Closure Force	White	572°F (300°C)
V8545-75	FFKM	75	High Temperature, FDA	Black	572°F (300°C)
V8562-75	FFKM	75	Low Leachables, FDA	White	572°F (300°C)
V8581-90	FFKM	90	Plasma, Low Outgassing	White	572°F (300°C)
V8588-90	FFKM	90	Plasma, Low Outgassing	Black	536°F (280°C)

*Kalrez Compound*	*Industry*	*Elastomer*	*Hardness Shore A*	*Applications*	*Color*	*Temp °C*
4079UP	Semicon	FFKM	75	Thermal applications	Black	316°C
2037UP	Semicon	FFKM	79	High purity	White	220°C
6375UP	Semicon	FFKM	75	Wet process applications, low elemental extractables, static and dynamic applications	Black	275°C
7075UP	Semicon	FFKM	75	Thermal applications	Black	327°C
8002	Semicon	FFKM	69	Select Semicon plasma and gas deposition applications, low particle generation	Clear	250°C
Sahara™ 8085	Semicon	FFKM	80	Plasma and gas deposition, HDPCVD, PECVD, SACVD, Etch, Ash, low particle generation o-rings and bonded doors	Beige	240°C
Sahara™ 8475	Semicon	FFKM	60	Thermal applications	White	300°C
Sahara™ 8575	Semicon	FFKM	62	Etch - low weight loss in oxygen and fluorine based plasmas	White	300°C
9100	Semicon	FFKM	74	High hardness, high modulus, excellent resistance	Amber translucent	300°C

*Simriz Compound*	*Elastomer*	*Hardness (Shore A)*	*Application*	*Color*	Temp (°C)
Simriz 134	FFKM	90	Simriz134 is a high strength, high Durometer Perfluoroelastomer developed for CPI and HPI applications.	Black	300
Simriz 481	FFKM	70	General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers	Black	230
Simriz 484	FFKM	75	USP Class VI, FDA compliant, wide chemical resistance, excellent heat resistance	Black	230
Simriz 485	FFKM	75	General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers	Black	230
Simriz 486	FFKM	75	General purpose, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant	White	230
Simriz 487	FFKM	75	High temperature, Wet processes, Etching, stripping, Copper plating	Black	300
Simriz 488	FFKM	70	High temperature, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion, lamp anneal	White	300
Simriz 489	FFKM	65	High purity, Excellent Plasma resistance, low particulation & Extraction, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion	Clear	280
Simriz 495	FFKM	80	General purpose, improved chemical and solvent resistance including Nitric acid and amine chemicals	Black	230
Superior F815	Enhanced FKM	75	General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography	Black	220
Superior F850	Enhanced FKM	85	General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography	Off-White	200
Superior F880	Enhanced FKM	75	High Performance, plasma resistance, minimal particulation, Deposition, Plasma Etch, Metalization, Ion Implant, CVD, lithography	Ivory	150

Chemraz® Compound	Elastomer	Hardness (Shore A)	Application	Color	Temp (°C)
Chemraz® XCD	FFKM	74	High Thermal Resistance, Low Compression Set (LPCVD, RTP, Thermal CVD, ALD)	Black	300°C
Chemraz® XRZ	FFKM	67	Plasma Resistance in High Fluorine Environments. Deposition (CVD, PECVD, HDPCVD, PEALD), Plasma etch (fluorine species), Remote plasma cleans	Translucent Brown	300°C
Chemraz® 513	FFKM	80	Good Plasma Resistance and Good Physical Properties, CVD, PVD, sputtering, evaporation, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, Dry plasma etch	White	210°C
Chemraz® 520	FFKM	90	Withstands harsh chemistries and high sealing loads, Metallization, Deposition, Dry Plasma etch, Dry ashing	White	240°C
Chemraz® 543	FFKM	80	Good Plasma Resistance and Good Physical Properties, Metallization, Deposition, Dry Plasma etch, Dry ashing	White	210°C
Chemraz® 550	FFKM	75	Excellent Acid Resistance, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating	Black	210°C
Chemraz® 551	FFKM	80	Broad Chemical Compatibility, High Temperature, Wet etch , Wet photo resist strip, Wet Cleaning	Black	316°C
Chemraz® 570	FFKM	70	Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP	White	210°C
Chemraz® 571	FFKM	80	Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP	White	210°C
Chemraz® 592	FFKM	80	Excellent Resistance to Plasma, good physical properties, Dry ashing, Oxidation, Metallization, Deposition, Dry plasma etch	White	240°C
Chemraz® 629	FFKM	75	Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch	Translucent Ivory	260°C
Chemraz® 639	FFKM	80	Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch	Translucent Ivory	260°C
Chemraz® 640	FFKM	80	Minimal Particulation, High Purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch, RTP/diffusion	Brown	290°C
Chemraz® 644	FFKM	75	Minimal contamination in Dry Plasma Processes, High Temperature, Dry plasma etch, Dry ashing	Dark Green	315°C
Chemraz® 653	FFKM	80	High Temp, superior comp set, Excellent plasma resistance, Oxidation (LPCVD), Diffusion, RTP	Black	324°C
Chemraz® 655	FFKM	82	High Temp, Minimal contamination, withstands aggressive chemicals, RTP, Oxidation (LPCVD), Diffusion	Off-White	315°C
Chemraz® 656	FFKM	70	Bonded Slit Valve Gates, Very Low Metallic Ion Content, low sealing force, Deposition, Dry plasma etch, remote plasma cleans	Translucent	232°C
Chemraz® 661	FFKM	80	Minimal Particulation, Maximum Plasma Resistance, Deposition, Dry plasma etch, remote plasma cleans	White	260°C
Chemraz® 667	FFKM	65	Enhanced Performance in Dry O2 Based Plasma Etch, High Temp, low comp set	Burgundy	300°C
Chemraz® E38	FFKM	70	Minimal contamination, low metal ion content, withstands aggressive chemicals, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, plasma cleans	White	260°C

Perlast Compound	Elastomer	Hardness (Shore A)	Application	Color	Temp
G100XT	FFKM	62	Advanced wet and dry semiconductor processes, low out gassing, HDPCVD, PECVD, SACVD, lithography, RTP, PVD, ALD	Translucent clear	-20°C to +275°C
G67P	FFKM	63	Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers	Translucent	-15°C to +275°C
G70A	FFKM	70	Exceptionally high chemical resistance and excellent steam resistance and mechanical properties, Extreme low outgassing properties.	Black	-15°C to +260°C
G70H	FFKM	70	Excellent chemical resistance, steam resistance and mechanical properties. Extremely low outgassing properties.	White	-15°C to +310°C
G74P	FFKM	74	Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers	Translucent Beige	-15°C to +275°C
G74S	FFKM	72	FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels.	White	-15°C to +260°C
G75B	FFKM	79	Excellent chemical resistance to a wide range of chemicals, acid and amine resistance, good mechanical properties, low out gassing	Black	-15°C to +325°C
G75G	FFKM	73	Chemical Process and Analytical Science industries. good chemical resistance coupled with easy identification	Green	-15°C to +310°C
G75H	FFKM	80	High temp, Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD, lithography, low metal ion content	Off-White	-15°C to +320°C
G75M	FFKM	75	Resistant to a broad range of chemicals, extremely low compression set	Black	-15°C to +260°C
G75S	FFKM	80	FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels.	White	-15°C to +310°C
G76W	FFKM	75	Excellent plasma resistance, clean high performance material for use in demanding applications within the semiconductor and flat panel display industries.	Ivory	-15°C to +260°C
G80A	FFKM	81	Broad range of chemical resistance, acid, amine, chlorine & solvent resistant	Black	-15°C to +260°C
G90A	FFKM	86	Exceptionally high chemical resistance and excellent steam resistance and mechanical properties. Extremely low outgassing properties.	Black	-10°C to +260°C
K13X	HPE	80	Good plasma resistance, low outgassing, Dry Semiconductor process, Dry Etch, ALD, Solar	Brown	-15°C to +280°C
Y75N	Advanced Fluoropolymer	68	Oxygen plasma resistance, Dry plasma etch, Wet Etch, dry ashing, oxidation, diffusion, lithography	Brown	-20°C to +180°C

compounds by markets
Aerospace Common ASTM & SAE Specifications Energy, Oil & Gas FDA, USDA, NSF51, USP Class VI Approved Life Science Military Fluid Specifications Military Rubber Specifications NSF 61 Approved Semiconductor - Parker Compounds Semiconductor Applications, Process & Product Semiconductor, Micro-e UL Listed Compounds

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Semiconductor, Micro-E, Compounds by Markets, Rubber Materials