DESCRIPTION: Chomerics has been a leading manufacturer and innovator of thermal management products that extend the life and reliability of electronic devices for over three decades.
Product Category: specialized materials and configurations are available for virtually any design
requirement, with a range of thermal and dielectric properties:
THERMFLOW PHASE-CHANGE MATERIALS: The THERMFLOW family of phase-change thermal
interface materials combines the consistency and ease of use of elastomeric pads with the low
thermal impedance of thermal grease. This winning combination makes Chomerics’ THERMFLOW materials an excellent choice for many of today’s most demanding thermal interface applications.
THERMATTACH® THERMALLY CONDUCTIVE ADHESIVE TAPES: The THERMATTACH family of
thermally conductive adhesive tapes is used extensively to bond heat sinks to microprocessors and other power-dissipating semiconductors. Offered with a choice of aluminum oxide or titanium diboride fillers coated on Kapton† film, aluminum foil, fiberglass or expanded aluminum, these tapes combine exceptional bonding strength with low thermal impedance to effectively replace thermal grease and mechanical fasteners.
CHO-THERM® ELASTOMERIC INSULATORS: Used throughout the world, CHO-THERM thermal
interface pads conform to uneven surfaces to lower the thermal resistance between hot
components and heat sinks. CHO-THERM pads can provide electrical insulation while improving the thermal management of electronic systems, and lowering assembly costs.
THERM-A-GAPTM THERMALLY CONDUCTIVE GAP FILLERS: The THERM-A-GAP family of thermal
interface materials fill air gaps between hot components and heat sinks or metal chassis. Their
flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates.
THERM-A-FORMTM THERMALLY CONDUCTIVE COMPOUNDS: These thermally conductive
silicone elastomers are supplied as kits containing liquid reactive components. Mixed and allowed to cure, they produce a flexible, low modulus rubber that is ideal for heat transfer applications in electronic component cooling.
T-WING® & C-WINGTM HEAT SPREADERS: Chomerics’ family of thin heat spreaders provides a
low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks aren’t appropriate. C-Wing spreaders are a ceramic version which are available for EMI-sensitive applications. They consist of aluminum oxide or aluminum nitride substrates with the same PSA used on T-Wing heat spreaders.
SEMICONDUCTOR PACKAGING MATERIALS: These products utilize Chomerics’ expertise in
thermal management for the industry’s most demanding package requirements. THERMFLOWTM T443 and T725 materials provide superior, grease-like performance for direct, backside of die interface in flip chip packages. THERMATTACH® T421, T422, T424 and T427 tapes offer outstanding adhesive characteristics, improved thermal performance and reduced assembly times.
Support: Materials have been designed into thousands of electronic devices and systems in the
commercial and military environments. Their performance benefits extend to sophisticated applications inside semiconductor packages. Chomerics’ supports its customers with comprehensive Applications Engineering and worldwide stocking and fabrication.
