Compounds by Market

Semiconductor, Micro-E

Compound  Recommended For  Temperature  Color
 Ethylene Propylene (EPR, EPM, EPDM)
 E0803-70  General Purpose  -70° to 250°F  Black
 E0692-75  Steam Resistant, operates at 450°F in Steam  -70° to 250°F  Black
 E0540-80   General Purpose  -70° to 250°F  Black
 E0652-90  General Purpose  -60° to 250°F  Black
 E0962-90  Excellent Steam resistant, operates at 500°F in
 steam
-60° to 250°F  Black
 Fluorocarbon (FKM, FPM ) 
 V0986-50  General Purpose  -15° to 400°F  Brown
 V1033-70

 White General Purpose

 -15° to 400°F  White
 V0747-75  General Purpose  -15° to 400°F  Black
 V0884-75  General Purpose  -15° to 400°F  Brown
 V1164-75  General Purpose  -15° to 400°F  Black
 V1274-75  Clean, Low extractables  -15° to 400°F  Black
 V0709-90  General Purpose  -15° to 400°F  Black
 V0894-90  General Purpose  -15° to 400°F  Brown
 V1260-75  Most Chemical Resistant FKM. Similar chemical 
 resistance to highly fluorinated compounds
 with  significant cost savings
 -15° to 400°F  Black
 Fluorosilicone (FVMQ)
 LM159-70  General Purpose  -100° to 350°F  Blue
 Hifluor (Highly Fluorinated FKM)
 V3819-75  Chemical Resistant, Low Compression Set  -15° to 400°F  Black
 V8534-90  Chemical Resistant, Extrusion Resistant  -15° to 400°F  Black
 Nitrile (Buan-N, NBR) 
 N0674-70  General Purpose  -30° to 250°F  Black
 N1470-70  General Purpose  -30° to 250°F  Black
 N0552-90  General Purpose  -30° to 250°F  Black
 N1490-90  General Purpose  -30° to 250°F  Black
 Parofluor (FFKM) 
 V1266-65  Plasma, Low Closure Force  5° to 572°F  White
 V8545-75  High Temperature, FDA  5° to 572°F  Black
 V8562-75  Low Leachables, FDA  5° to 572°F  White
 V8581-90  Plasma, Low Outgassing  5° to 572°F  White
 V8588-90  Plasma, Low Outgassing 5° to 536°F  Black
 Parofluor Ultra (FFKM)
 FF102-75  Acid Resistant 525 °C  Black
 FF200-75  High Temp, Low Compression Set,
 Chemical  resistance
 5° to 608°F  Black
 FF202-90  High Temp, Low Compression Set, Chemical  resistance  5° to 608°F  Black
 FF350-75  High Purity, High Temp, Low Compression Set  5° to 600°F  White
 FF352-75  Clean, Improved O2 Plasma resistance, High  Temp, Low Compression set  5° to 600°F  White
 FF354-65  High Purity, High Temp, Low Closure Force  5° to 600°F  White
 FF356-75  High Purity, High Temp, Low Compression Set  5° to 600°F  White
 FF370-75  Non-filled High Purity, low extractable, Minimum  particles, High Temp, low compression set (no  fillers)  5° to 572°F  Opaque- Black
 FF500-75  Broad Chemical Resistance  5° to 525°F  Black
 Silicone (VMQ, PVMQ)
 S0469-40  General Purpose  -65° to 450°F  Rust
 S0595-50  General Purpose  -65° to 450°F  Rust
 S0613-60  General Purpose  -65° to 450°F  Rust
 S0455-70  High Temperature  -65° to 500°F  Rust
 S0604-70  General Purpose  -65° to 450°F  Rust
 S1224-70  General Purpose  -65° to 450°F  Rust
 
   
   
 

Kalrez Compound

Industry

Elastomer

Hardness Shore A

Applications

Color

Temp °C

 4079UP

Semicon

FFKM

75

Thermal applications

Black

316°C

 2037UP

Semicon

FFKM

79

High purity

White

220°C

 6375UP

Semicon

FFKM

75

Wet process applications, low elemental extractables, static and dynamic applications

Black

275°C

 7075UP

Semicon

FFKM

75

Thermal applications

Black

327°C

 8002

Semicon

FFKM

69

Select Semicon plasma and gas deposition applications, low particle generation

Clear

250°C

 Sahara™ 8085

Semicon

FFKM

80

Plasma and gas deposition, HDPCVD, PECVD, SACVD, Etch, Ash, low particle generation o-rings and bonded doors

Beige

240°C

 Sahara™ 8475

Semicon

FFKM

60

Thermal applications

White

300°C

 Sahara™ 8575

Semicon

FFKM

62

Etch - low weight loss in oxygen and fluorine based plasmas

White

300°C

 9100

Semicon

FFKM

74

High hardness, high modulus, excellent resistance

Amber translucent

300°C

 

Simriz Compound
Elastomer
Hardness (Shore A)
Application
Color
Temp
(°C)
Simriz 134
FFKM
90
Simriz134 is a high strength, high Durometer Perfluoroelastomer developed for CPI and HPI applications.
Black
300
Simriz 481
FFKM
70
General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers
Black
230
Simriz 484
FFKM
75
USP Class VI, FDA compliant, wide chemical resistance, excellent heat resistance
Black
230
Simriz 485
FFKM
75
General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers
Black
230
Simriz 486
FFKM
75
General purpose, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant
White
230
Simriz 487
FFKM
75
High temperature, Wet processes, Etching, stripping, Copper plating
Black
300
Simriz 488
FFKM
70
High temperature, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion, lamp anneal
White
300
Simriz 489
FFKM
65
High purity, Excellent Plasma resistance, low particulation & Extraction, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion
Clear
280
Simriz 495
FFKM
80
General purpose, improved chemical and solvent resistance including Nitric acid and amine chemicals
Black
230
Superior F815
Enhanced FKM
75
General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography
Black
220
Superior F850
Enhanced FKM
85
General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography
Off-White
200
Superior F880
Enhanced FKM
75
High Performance, plasma resistance, minimal particulation, Deposition, Plasma Etch, Metalization, Ion Implant, CVD, lithography
Ivory
150

 

Chemraz® Compound
Elastomer
Hardness (Shore A)
Application
Color
Temp (°C)
Chemraz® XCD
FFKM
74
High Thermal Resistance, Low Compression Set (LPCVD, RTP, Thermal CVD, ALD)
Black
300°C
Chemraz® XRZ
FFKM
67
Plasma Resistance in High Fluorine Environments. Deposition (CVD, PECVD, HDPCVD, PEALD), Plasma etch (fluorine species), Remote plasma cleans
Translucent Brown
300°C
Chemraz® 513
FFKM
80
Good Plasma Resistance and Good Physical Properties, CVD, PVD, sputtering, evaporation, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, Dry plasma etch
White
210°C
Chemraz® 520
FFKM
90
Withstands harsh chemistries and high sealing loads, Metallization, Deposition, Dry Plasma etch, Dry ashing
White
240°C
Chemraz® 543
FFKM
80
Good Plasma Resistance and Good Physical Properties, Metallization, Deposition, Dry Plasma etch, Dry ashing
White
210°C
Chemraz® 550
FFKM
75
Excellent Acid Resistance, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating
Black
210°C
Chemraz® 551
FFKM
80
Broad Chemical Compatibility, High Temperature, Wet etch , Wet photo resist strip, Wet Cleaning
Black
316°C
Chemraz® 570
FFKM
70
Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP
White
210°C
Chemraz® 571
FFKM
80
Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP
White
210°C
Chemraz® 592
FFKM
80
Excellent Resistance to Plasma, good physical properties, Dry ashing, Oxidation, Metallization, Deposition, Dry plasma etch
White
240°C
Chemraz® 629
FFKM
75
Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch
Translucent Ivory
260°C
Chemraz® 639
FFKM
80
Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch
Translucent Ivory
260°C
Chemraz® 640
FFKM
80
Minimal Particulation, High Purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch, RTP/diffusion
Brown
290°C
Chemraz® 644
FFKM
75
Minimal contamination in Dry Plasma Processes, High Temperature, Dry plasma etch, Dry ashing
Dark Green
315°C
Chemraz® 653
FFKM
80
High Temp, superior comp set, Excellent plasma resistance, Oxidation (LPCVD), Diffusion, RTP
Black
324°C
Chemraz® 655
FFKM
82
High Temp, Minimal contamination, withstands aggressive chemicals, RTP, Oxidation (LPCVD), Diffusion
Off-White
315°C
Chemraz® 656
FFKM
70
Bonded Slit Valve Gates, Very Low Metallic Ion Content, low sealing force, Deposition, Dry plasma etch, remote plasma cleans
Translucent
232°C
Chemraz® 661
FFKM
80
Minimal Particulation, Maximum Plasma Resistance, Deposition, Dry plasma etch, remote plasma cleans
White
260°C
Chemraz® 667
FFKM
65
Enhanced Performance in Dry O2 Based Plasma Etch, High Temp, low comp set
Burgundy
300°C
Chemraz® E38
FFKM
70
Minimal contamination, low metal ion content, withstands aggressive chemicals, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, plasma cleans
White
260°C

 

Perlast Compound
Elastomer
Hardness (Shore A)
Application
Color
Temp
G100XT
FFKM
62
Advanced wet and dry semiconductor processes, low out gassing, HDPCVD, PECVD, SACVD, lithography, RTP, PVD, ALD 
Translucent clear
-20°C to +275°C
 G67P
FFKM
63
Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers
Translucent
-15°C to +275°C
 G70A
FFKM
70
Exceptionally high chemical resistance and excellent steam resistance and mechanical properties, Extreme low outgassing properties.
Black
-15°C to +260°C
 G70H
FFKM
70
Excellent chemical resistance, steam resistance and mechanical properties. Extremely low outgassing properties.
White
-15°C to +310°C
 G74P
FFKM
74
Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers
Translucent Beige
-15°C to +275°C
 G74S
FFKM
72
FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels.
White
-15°C to +260°C
 G75B
FFKM
79
Excellent chemical resistance to a wide range of chemicals, acid and amine resistance, good mechanical properties, low out gassing
Black
-15°C to +325°C
 G75G
FFKM
73
Chemical Process and Analytical Science industries. good chemical resistance coupled with easy identification
Green
-15°C to +310°C
 G75H
FFKM
80
High temp, Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD, lithography, low metal ion content 
Off-White
-15°C to +320°C
 G75M
FFKM
75
Resistant to a broad range of chemicals, extremely low compression set
Black
-15°C to +260°C
 G75S
FFKM
80
FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels.
White
-15°C to +310°C
 G76W
FFKM
75
Excellent plasma resistance, clean high performance material for use in demanding applications within the semiconductor and flat panel display industries.
Ivory
-15°C to +260°C
 G80A
FFKM
81
Broad range of chemical resistance, acid, amine, chlorine & solvent resistant 
Black
-15°C to +260°C
 G90A
FFKM
86
Exceptionally high chemical resistance and excellent steam resistance and mechanical properties. Extremely low outgassing properties.
Black
-10°C to +260°C
 K13X
HPE
80
Good plasma resistance, low outgassing, Dry Semiconductor process, Dry Etch, ALD, Solar
Brown
-15°C to +280°C
 Y75N
Advanced Fluoropolymer
68
Oxygen plasma resistance, Dry plasma etch, Wet Etch, dry ashing, oxidation, diffusion, lithography  
Brown
-20°C to +180°C