

Semiconductor, Micro-E
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Kalrez Compound |
Industry |
Elastomer |
Hardness Shore A |
Applications |
Color |
Temp °C |
Semicon |
FFKM |
75 |
Thermal applications |
Black |
316°C |
|
Semicon |
FFKM |
79 |
High purity |
White |
220°C |
|
Semicon |
FFKM |
75 |
Wet process applications, low elemental extractables, static and dynamic applications |
Black |
275°C |
|
Semicon |
FFKM |
75 |
Thermal applications |
Black |
327°C |
|
Semicon |
FFKM |
69 |
Select Semicon plasma and gas deposition applications, low particle generation |
Clear |
250°C |
|
Semicon |
FFKM |
80 |
Plasma and gas deposition, HDPCVD, PECVD, SACVD, Etch, Ash, low particle generation o-rings and bonded doors |
Beige |
240°C |
|
Semicon |
FFKM |
60 |
Thermal applications |
White |
300°C |
|
Semicon |
FFKM |
62 |
Etch - low weight loss in oxygen and fluorine based plasmas |
White |
300°C |
|
Semicon |
FFKM |
74 |
High hardness, high modulus, excellent resistance |
Amber translucent |
300°C |
Simriz Compound
|
Elastomer
|
Hardness (Shore A)
|
Application
|
Color
|
Temp
(°C) |
FFKM
|
90
|
Simriz134 is a high strength, high Durometer Perfluoroelastomer developed for CPI and HPI applications. |
Black
|
300
|
|
FFKM
|
70
|
General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers |
Black
|
230
|
|
FFKM
|
75
|
USP Class VI, FDA compliant, wide chemical resistance, excellent heat resistance |
Black
|
230
|
|
FFKM
|
75
|
General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers |
Black
|
230
|
|
FFKM
|
75
|
General purpose, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant |
White
|
230
|
|
FFKM
|
75
|
High temperature, Wet processes, Etching, stripping, Copper plating |
Black
|
300
|
|
FFKM
|
70
|
High temperature, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion, lamp anneal |
White
|
300
|
|
FFKM
|
65
|
High purity, Excellent Plasma resistance, low particulation & Extraction, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion |
Clear
|
280
|
|
FFKM
|
80
|
General purpose, improved chemical and solvent resistance including Nitric acid and amine chemicals |
Black
|
230
|
|
Enhanced FKM
|
75
|
General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography |
Black
|
220
|
|
Enhanced FKM
|
85
|
General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography |
Off-White
|
200
|
|
Enhanced FKM
|
75
|
High Performance, plasma resistance, minimal particulation, Deposition, Plasma Etch, Metalization, Ion Implant, CVD, lithography |
Ivory
|
150
|
Chemraz® Compound
|
Elastomer
|
Hardness (Shore A)
|
Application
|
Color
|
Temp (°C)
|
FFKM
|
74
|
High Thermal Resistance, Low Compression Set (LPCVD, RTP, Thermal CVD, ALD) |
Black
|
300°C
|
|
FFKM
|
67
|
Plasma Resistance in High Fluorine Environments. Deposition (CVD, PECVD, HDPCVD, PEALD), Plasma etch (fluorine species), Remote plasma cleans |
Translucent Brown
|
300°C
|
|
FFKM
|
80
|
Good Plasma Resistance and Good Physical Properties, CVD, PVD, sputtering, evaporation, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, Dry plasma etch |
White
|
210°C
|
|
FFKM
|
90
|
Withstands harsh chemistries and high sealing loads, Metallization, Deposition, Dry Plasma etch, Dry ashing |
White
|
240°C
|
|
FFKM
|
80
|
Good Plasma Resistance and Good Physical Properties, Metallization, Deposition, Dry Plasma etch, Dry ashing |
White
|
210°C
|
|
FFKM
|
75
|
Excellent Acid Resistance, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating |
Black
|
210°C
|
|
FFKM
|
80
|
Broad Chemical Compatibility, High Temperature, Wet etch , Wet photo resist strip, Wet Cleaning |
Black
|
316°C
|
|
FFKM
|
70
|
Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP |
White
|
210°C
|
|
FFKM
|
80
|
Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP |
White
|
210°C
|
|
FFKM
|
80
|
Excellent Resistance to Plasma, good physical properties, Dry ashing, Oxidation, Metallization, Deposition, Dry plasma etch |
White
|
240°C
|
|
FFKM
|
75
|
Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch |
Translucent Ivory
|
260°C
|
|
FFKM
|
80
|
Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch |
Translucent Ivory
|
260°C
|
|
FFKM
|
80
|
Minimal Particulation, High Purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch, RTP/diffusion |
Brown
|
290°C
|
|
FFKM
|
75
|
Minimal contamination in Dry Plasma Processes, High Temperature, Dry plasma etch, Dry ashing |
Dark Green
|
315°C
|
|
FFKM
|
80
|
High Temp, superior comp set, Excellent plasma resistance, Oxidation (LPCVD), Diffusion, RTP |
Black
|
324°C
|
|
FFKM
|
82
|
High Temp, Minimal contamination, withstands aggressive chemicals, RTP, Oxidation (LPCVD), Diffusion |
Off-White
|
315°C
|
|
FFKM
|
70
|
Bonded Slit Valve Gates, Very Low Metallic Ion Content, low sealing force, Deposition, Dry plasma etch, remote plasma cleans |
Translucent
|
232°C
|
|
FFKM
|
80
|
Minimal Particulation, Maximum Plasma Resistance, Deposition, Dry plasma etch, remote plasma cleans |
White
|
260°C
|
|
FFKM
|
65
|
Enhanced Performance in Dry O2 Based Plasma Etch, High Temp, low comp set |
Burgundy
|
300°C
|
|
FFKM
|
70
|
Minimal contamination, low metal ion content, withstands aggressive chemicals, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, plasma cleans |
White
|
260°C
|
Perlast Compound
|
Elastomer
|
Hardness (Shore A)
|
Application
|
Color
|
Temp
|
![]() |
FFKM
|
62
|
Advanced wet and dry semiconductor processes, low out gassing, HDPCVD, PECVD, SACVD, lithography, RTP, PVD, ALD |
Translucent clear
|
-20°C to +275°C
|
![]() |
FFKM
|
63
|
Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers |
Translucent
|
-15°C to +275°C
|
![]() |
FFKM
|
70
|
Exceptionally high chemical resistance and excellent steam resistance and mechanical properties, Extreme low outgassing properties. |
Black
|
-15°C to +260°C
|
![]() |
FFKM
|
70
|
Excellent chemical resistance, steam resistance and mechanical properties. Extremely low outgassing properties. |
White
|
-15°C to +310°C
|
![]() |
FFKM
|
74
|
Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers |
Translucent Beige
|
-15°C to +275°C
|
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FFKM
|
72
|
FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels. |
White
|
-15°C to +260°C
|
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FFKM
|
79
|
Excellent chemical resistance to a wide range of chemicals, acid and amine resistance, good mechanical properties, low out gassing |
Black
|
-15°C to +325°C
|
![]() |
FFKM
|
73
|
Chemical Process and Analytical Science industries. good chemical resistance coupled with easy identification |
Green
|
-15°C to +310°C
|
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FFKM
|
80
|
High temp, Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD, lithography, low metal ion content |
Off-White
|
-15°C to +320°C
|
![]() |
FFKM
|
75
|
Resistant to a broad range of chemicals, extremely low compression set |
Black
|
-15°C to +260°C
|
![]() |
FFKM
|
80
|
FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels. |
White
|
-15°C to +310°C
|
![]() |
FFKM
|
75
|
Excellent plasma resistance, clean high performance material for use in demanding applications within the semiconductor and flat panel display industries. |
Ivory
|
-15°C to +260°C
|
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FFKM
|
81
|
Broad range of chemical resistance, acid, amine, chlorine & solvent resistant |
Black
|
-15°C to +260°C
|
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FFKM
|
86
|
Exceptionally high chemical resistance and excellent steam resistance and mechanical properties. Extremely low outgassing properties. |
Black
|
-10°C to +260°C
|
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HPE
|
80
|
Good plasma resistance, low outgassing, Dry Semiconductor process, Dry Etch, ALD, Solar |
Brown
|
-15°C to +280°C
|
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Advanced Fluoropolymer
|
68
|
Oxygen plasma resistance, Dry plasma etch, Wet Etch, dry ashing, oxidation, diffusion, lithography |
Brown
|
-20°C to +180°C
|