Semiconductor, Micro-E

Compound  Recommended For  Temperature  Color
 Ethylene Propylene (EPR, EPM, EPDM)
 E0803-70  General Purpose  -70° to 250°F  Black
 E0692-75  Steam Resistant, operates at 450°F in Steam  -70° to 250°F  Black
 E0540-80   General Purpose  -70° to 250°F  Black
 E0652-90  General Purpose  -60° to 250°F  Black
 E0962-90  Excellent Steam resistant, operates at 500°F in
 steam		 -60° to 250°F  Black
 Fluorocarbon (FKM, FPM ) 
 V0986-50  General Purpose  -15° to 400°F  Brown
 V1033-70

 White General Purpose

  -15° to 400°F  White
 V0747-75  General Purpose  -15° to 400°F  Black
 V0884-75  General Purpose  -15° to 400°F  Brown
 V1164-75  General Purpose  -15° to 400°F  Black
 V1274-75  Clean, Low extractables  -15° to 400°F  Black
 V0709-90  General Purpose  -15° to 400°F  Black
 V0894-90  General Purpose  -15° to 400°F  Brown
 V1260-75  Most Chemical Resistant FKM. Similar chemical 
 resistance to highly fluorinated compounds
 with  significant cost savings		  -15° to 400°F  Black
 Fluorosilicone (FVMQ)
 LM159-70  General Purpose  -100° to 350°F  Blue
 Hifluor (Highly Fluorinated FKM)
 V3819-75  Chemical Resistant, Low Compression Set  -15° to 400°F  Black
 V8534-90  Chemical Resistant, Extrusion Resistant  -15° to 400°F  Black
 Nitrile (Buan-N, NBR) 
 N0674-70  General Purpose  -30° to 250°F  Black
 N1470-70  General Purpose  -30° to 250°F  Black
 N0552-90  General Purpose  -30° to 250°F  Black
 N1490-90  General Purpose  -30° to 250°F  Black
 Parofluor (FFKM) 
 V1266-65  Plasma, Low Closure Force  5° to 572°F  White
 V8545-75  High Temperature, FDA  5° to 572°F  Black
 V8562-75  Low Leachables, FDA  5° to 572°F  White
 V8581-90  Plasma, Low Outgassing  5° to 572°F  White
 V8588-90  Plasma, Low Outgassing 5° to 536°F  Black
 Parofluor Ultra (FFKM)
 FF102-75  Acid Resistant 525 °C  Black
 FF200-75  High Temp, Low Compression Set,
 Chemical  resistance		  5° to 608°F  Black
 FF202-90  High Temp, Low Compression Set, Chemical  resistance  5° to 608°F  Black
 FF350-75  High Purity, High Temp, Low Compression Set  5° to 600°F  White
 FF352-75  Clean, Improved O2 Plasma resistance, High  Temp, Low Compression set  5° to 600°F  White
 FF354-65  High Purity, High Temp, Low Closure Force  5° to 600°F  White
 FF356-75  High Purity, High Temp, Low Compression Set  5° to 600°F  White
 FF370-75  Non-filled High Purity, low extractable, Minimum  particles, High Temp, low compression set (no  fillers)  5° to 572°F  Opaque- Black
 FF500-75  Broad Chemical Resistance  5° to 525°F  Black
 Silicone (VMQ, PVMQ)
 S0469-40  General Purpose  -65° to 450°F  Rust
 S0595-50  General Purpose  -65° to 450°F  Rust
 S0613-60  General Purpose  -65° to 450°F  Rust
 S0455-70  High Temperature  -65° to 500°F  Rust
 S0604-70  General Purpose  -65° to 450°F  Rust
 S1224-70  General Purpose  -65° to 450°F  Rust
 
   
   
 

Kalrez Compound

Industry

Elastomer

Hardness Shore A

Applications

Color

Temp °C

 4079UP

Semicon

FFKM

75

Thermal applications

Black

316°C

 2037UP

Semicon

FFKM

79

High purity

White

220°C

 6375UP

Semicon

FFKM

75

Wet process applications, low elemental extractables, static and dynamic applications

Black

275°C

 7075UP

Semicon

FFKM

75

Thermal applications

Black

327°C

 8002

Semicon

FFKM

69

Select Semicon plasma and gas deposition applications, low particle generation

Clear

250°C

 Sahara™ 8085

Semicon

FFKM

80

Plasma and gas deposition, HDPCVD, PECVD, SACVD, Etch, Ash, low particle generation o-rings and bonded doors

Beige

240°C

 Sahara™ 8475

Semicon

FFKM

60

Thermal applications

White

300°C

 Sahara™ 8575

Semicon

FFKM

62

Etch - low weight loss in oxygen and fluorine based plasmas

White

300°C

 9100

Semicon

FFKM

74

High hardness, high modulus, excellent resistance

Amber translucent

300°C

 

Simriz Compound
Elastomer
Hardness (Shore A)
Application
Color
Temp
(°C)
FFKM
90
 Simriz134 is a high strength, high Durometer Perfluoroelastomer developed for CPI and HPI applications.
Black
300
FFKM
70
 General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers
Black
230
FFKM
75
 USP Class VI, FDA compliant, wide chemical resistance, excellent heat resistance
Black
230
FFKM
75
 General purpose, Excellent Chemical Compatibility, acids, Steam/hot water, Chemical & Hydrocarbon processing, aromatic/aliphatic Oils, ethers
Black
230
FFKM
75
 General purpose, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant
White
230
FFKM
75
 High temperature, Wet processes, Etching, stripping, Copper plating
Black
300
FFKM
70
 High temperature, Excellent Plasma resistance, low particulation, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion, lamp anneal
White
300
FFKM
65
 High purity, Excellent Plasma resistance, low particulation & Extraction, Deposition, Plasma Etch, Metalization, Ion Implant, RTP, oxidation, diffusion
Clear
280
FFKM
80
 General purpose, improved chemical and solvent resistance including Nitric acid and amine chemicals
Black
230
Enhanced FKM
75
 General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography
Black
220
Enhanced FKM
85
 General purpose, plasma resistance, Deposition, Plasma Etch, Metalization, Ion Implant, lithography
Off-White
200
Enhanced FKM
75
 High Performance, plasma resistance, minimal particulation, Deposition, Plasma Etch, Metalization, Ion Implant, CVD, lithography
Ivory
150

 

Chemraz® Compound
Elastomer
Hardness (Shore A)
Application
Color
Temp (°C)
FFKM
74
 High Thermal Resistance, Low Compression Set (LPCVD, RTP, Thermal CVD, ALD)
Black
300°C
FFKM
67
 Plasma Resistance in High Fluorine Environments. Deposition (CVD, PECVD, HDPCVD, PEALD), Plasma etch (fluorine species), Remote plasma cleans
Translucent Brown
300°C
FFKM
80
 Good Plasma Resistance and Good Physical Properties, CVD, PVD, sputtering, evaporation, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, Dry plasma etch
White
210°C
FFKM
90
 Withstands harsh chemistries and high sealing loads, Metallization, Deposition, Dry Plasma etch, Dry ashing
White
240°C
FFKM
80
 Good Plasma Resistance and Good Physical Properties, Metallization, Deposition, Dry Plasma etch, Dry ashing
White
210°C
FFKM
75
 Excellent Acid Resistance, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating
Black
210°C
FFKM
80
 Broad Chemical Compatibility, High Temperature, Wet etch , Wet photo resist strip, Wet Cleaning
Black
316°C
FFKM
70
 Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP
White
210°C
FFKM
80
 Low contaminants, good physical properties, Wet etch (acid, base), wet stripping (solvents), wet cleaning (UPDI), wet metal plating, CMP
White
210°C
FFKM
80
 Excellent Resistance to Plasma, good physical properties, Dry ashing, Oxidation, Metallization, Deposition, Dry plasma etch
White
240°C
FFKM
75
 Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch
Translucent Ivory
260°C
FFKM
80
 Minimal Particulation, High purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch
Translucent Ivory
260°C
FFKM
80
 Minimal Particulation, High Purity, Maximum Plasma Resistance, Deposition (CVD, PECVD, HDPCVD, PEALD), Dry Plasma etch, RTP/diffusion
Brown
290°C
FFKM
75
 Minimal contamination in Dry Plasma Processes, High Temperature, Dry plasma etch, Dry ashing
Dark Green
315°C
FFKM
80
 High Temp, superior comp set, Excellent plasma resistance, Oxidation (LPCVD), Diffusion, RTP
Black
324°C
FFKM
82
 High Temp, Minimal contamination, withstands aggressive chemicals, RTP, Oxidation (LPCVD), Diffusion
Off-White
315°C
FFKM
70
 Bonded Slit Valve Gates, Very Low Metallic Ion Content, low sealing force, Deposition, Dry plasma etch, remote plasma cleans
Translucent
232°C
FFKM
80
 Minimal Particulation, Maximum Plasma Resistance, Deposition, Dry plasma etch, remote plasma cleans
White
260°C
FFKM
65
 Enhanced Performance in Dry O2 Based Plasma Etch, High Temp, low comp set
Burgundy
300°C
FFKM
70
 Minimal contamination, low metal ion content, withstands aggressive chemicals, CVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD, plasma cleans
White
260°C

 

Perlast Compound
Elastomer
Hardness (Shore A)
Application
Color
Temp
G100XT
FFKM
62
 Advanced wet and dry semiconductor processes, low out gassing, HDPCVD, PECVD, SACVD, lithography, RTP, PVD, ALD 
Translucent clear
-20°C to +275°C
 G67P
FFKM
63
 Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers
Translucent
-15°C to +275°C
 G70A
FFKM
70
 Exceptionally high chemical resistance and excellent steam resistance and mechanical properties, Extreme low outgassing properties.
Black
-15°C to +260°C
 G70H
FFKM
70
 Excellent chemical resistance, steam resistance and mechanical properties. Extremely low outgassing properties.
White
-15°C to +310°C
 G74P
FFKM
74
 Excellent Mechanical properties, Wet and Dry processes, PVD, CVD, etch, lithography, plasma, stripping, cleaning, no organic fillers
Translucent Beige
-15°C to +275°C
 G74S
FFKM
72
 FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels.
White
-15°C to +260°C
 G75B
FFKM
79
 Excellent chemical resistance to a wide range of chemicals, acid and amine resistance, good mechanical properties, low out gassing
Black
-15°C to +325°C
 G75G
FFKM
73
 Chemical Process and Analytical Science industries. good chemical resistance coupled with easy identification
Green
-15°C to +310°C
 G75H
FFKM
80
 High temp, Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD, lithography, low metal ion content 
Off-White
-15°C to +320°C
 G75M
FFKM
75
 Resistant to a broad range of chemicals, extremely low compression set
Black
-15°C to +260°C
 G75S
FFKM
80
 FDA and USP Class VI compliance. Suited to withstand steam-in-place (SIP) and clean-in-place (CIP) procedures within pipe work and vessels.
White
-15°C to +310°C
 G76W
FFKM
75
 Excellent plasma resistance, clean high performance material for use in demanding applications within the semiconductor and flat panel display industries.
Ivory
-15°C to +260°C
 G80A
FFKM
81
 Broad range of chemical resistance, acid, amine, chlorine & solvent resistant 
Black
-15°C to +260°C
 G90A
FFKM
86
 Exceptionally high chemical resistance and excellent steam resistance and mechanical properties. Extremely low outgassing properties.
Black
-10°C to +260°C
 K13X
HPE
80
 Good plasma resistance, low outgassing, Dry Semiconductor process, Dry Etch, ALD, Solar
Brown
-15°C to +280°C
 Y75N
Advanced Fluoropolymer
68
 Oxygen plasma resistance, Dry plasma etch, Wet Etch, dry ashing, oxidation, diffusion, lithography  
Brown
-20°C to +180°C