Device Assembly

Assembly Processes include:

• Ultra-Precision, precision & Standard assembly
• Electron-Mechanical assembly
• Catheter Assembly
• Nitinol wire forming
• Thermal tip forming
• Solvent & Cyanoacrylate bonding
• UV adhesive, epoxy & polymer adhesive bonding
• P.C. Board assembly
• Precision & standard soldering
• Fiber optic processing including lens forming, polishing, bonding, gapping, cladding & fiber pyrolizing
• Flow leak and Tensile testing
• Glass forming
• Controlled Siliconizing & Silicone dispersion coating
• Gold Wire bonding
• Hermetic seal welding
• Electo-static bonding
• Ultra-sonic welding
• Thermal skating & staking
• Micro riveting
• Micro arc welding
• Ultra-sonic cleaning
• Automatic & Semi-automatic software controlled testing
• Electro-mechanical testing
• Packaging including pouch, pre-formed trays & form-fill-seal
• Sterilization including ethylene oxide & irradiation