Form-in-Place Conductive Elastomer Gaskets
CHOFORM® Automated Form-in-Place Gasket Technology (Cho-Form®, ParPHorm)
Chomerics' automated CHOFORM® technology dispenses form-in-place conductive elastomer gaskets on metal or plastic housings. The system applies programmed gasket beads with exceptional accuracy in three full axes, compensating for uneven surfaces in castings and molded parts to provide consistent, highly reliable seals. Gaskets can be applied on flanges as narrow as .030 inch (0.76 mm), affording more space for board components or allowing smaller overall packaging. Cho-Form gaskets cure in minutes and provide more than 75 dB attenuation from 200 MHz to 10 GHz.
Form-In-Place- Product Selector Guide (.pdf)
Corrosion Resistant Form-in-Place EMI Shielding Material
CHOFORM 5541 Corrosion Resistant Matl for Castings (.pdf)
CHOFORM 5550 Corrosion Resistant Data Sheet (.pdf)
CHOFORM 5550 and 5541 Corrosion Testing - Test Report (.pdf)
CHOFORM 5550 and 5541 Electrical Properties - Test Report (.pdf)
CHOFORM 5550 and 5541 Compression/Deflection - Test Report (.pdf)
CHOFORM 5541 Reliability Test Report (.pdf)
ParPHorm S1936, S1945, L1938 (non-conductive) Form-in-Place Sealing Compounds
ParPHorm is a family of non-conductive, thermal cure, form-in-place, elastomeric sealing compounds. These silicone and fluorosilicone materials provide environmental, fluid, and dust sealing of small enclosures. The product line consists of state-of-the art compounds designed to be robotically dispensed onto small housings and then thermally cured. Curing of the dispensed materials is done via in-line ovens at 230 o F for 40 minutes. Dispensed bead heights range from 0.018 in. (0.46 mm) to 0.13 in. (3.94 mm). Application advantages of the materials are resistance to a wide variety of fluids, excellent substrate adhesion, low hardness, and outstanding compression set properties.