T-Wing® and C-Wing™ heat spreaders provide a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks aren't appropriate. They typically provide junction temperature reduction of 20° C when applied on microprocessors and cache chips in laptop PCs and other high density, handheld electronics, and on disk drives. They're easily added by peel and stick application. T-Wing heat spreaders use copper as a thermal conductor. They conform to non-flat surfaces for optimal thermal and mechanical performance. C-Wing heat spreaders are ceramic, electrically non-conductive cooling solutions where localized sensitivity to EMI (electromagnetic interference) may be an issue.