EMI Shielding & Thermal Management – Thermal Management

Thermally Conductive Gap Fillers

THERM-A-GAP™ 569, 570, 579 and 580 materials are the result of Chomerics continuing product improvements. 570 and 580 represent a significant improvement in thermal performance and conformability over previous gap fillers and have rapidly achieved industry wide acceptance.

All four products are available on aluminum foil (A) or on “clean break” glass (G) fiber carrier. As with all previous Chomerics gap-fillers, the A versions have a high strength acrylic pressure sensitive adhesive for permanent attachment to the cold surfaces.

THERM-A-GAP™ 575-NS silicone free thermal interface pads are very soft and provide enhanced thermal performance. Material consists of an ultra soft Acrylic elastomer filled with ceramic particles. These pads are best suited for applications where a gap of approximately 0.5mm – 2.5mm needs to be filled.

THERM-A-GAP™ T630, T630G, T635, & T636 Gap Fillers - are Chomerics latest development in thermally conductive gap fillers. These unique materials are ideal for applications where typical gap filling pads cause too much stress on component solder joints and leads, resulting in damage to the printed circuit board. These gap fillers are highly conformable, one component pre-cured silicone that can be dispensed to fill large and uneven gaps in electronics assemblies. The viscoelastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly. The “G” versions contain 0.010” glass beads, used for a compression stop for applications requiring electrical isolation. All products have low extractable silicone levels and pass the Bellcore silicone extractable specification for the telecom industry.

THERM-A-GAP 97X Series thermally conductive interface pads are designed for use between heat generating components and their heat sinks. 97X materials conform to surface irregularities under moderate application pressures to fill air gaps and enhance heat transfer. They have a high thermal conductivity of 4.0 W/m-K. Pads range in thickness from 0.010 to 0.060 in. (0.25 to 1.5 mm). They include a fiberglass carrier for added strength during assembly and rework. G974 material is an electrically non-conductive, boron-nitride-filled silicone elastomer best suited for applications with pressures from 5 to 100 psi (0.03-0.69 MPa), and where high thermal performance is needed. 

THERM-A-GAP thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates. 

THERM-A-GAP A174 materials are suited for high volume, low cost applications, such as in automotive electronics, laptop PCs,etc. 

THERM-A-GAP A274 materials can be molded to meet exact dimensions required for optimum electronics packaging.

THERM-A-GAP A574 materials are ideal for heat flux typical of microprocessors, video chips and power semiconductors.

"Clean-Break" option available for 174 and 547 THERM-A-GAP materials. See product data sheet for G174 and G574.

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